Electronics packaging and the use of desiccant
The 2011 International Microelectronics and Packaging Society (IMPS) Symposium and Expo played host to an informative presentation by Sam Incorvia on the importance of using desiccant in the packaging of electronic goods.
While cushioning and shock-protection during transit are clearly important factors when shipping electronic equipment, moisture control is often overlooked. This can have disastrous consequences, especially in humid conditions, as even a small amount of moisture can damage or even destroy sensitive electrical goods unless relevant precautions are taken.
Incorvia explained: “As the trend in the electronics industry shifts more towards the use of thermoplastics in place of metals for electronic enclosures/devices, the need for moisture management in the design is an absolute must.”
He then went on to demonstrate a number of different desiccants, and explained the processes by which they work. The choice of desiccant to be used in a particular packaging application depends on the type of polymer from which the device’s enclosure is constructed.
In many cases, a solid-form desiccant can be integrated into the enclosure itself during assembly, which has the added advantage of eliminating any moisture that may be sealed within the unit at the time of manufacture.
